发明名称 MOLD COATED WITH HEAT INSULATING LAYER AND MOLDING METHOD OF SYNTHETIC RESIN USING THIS MOLD
摘要 PROBLEM TO BE SOLVED: To provide a mold for molding a synthetic resin which has improved mold surface reproducibility and dispense with the post-processing of moldings as well as a method for molding the resin using said mold. SOLUTION: This mold with a coated heat insulating layer has (1) a 0.1-2mm thick heat-insulating layer consisting of a polymer adhering to the wall face of a main mold mode of a metal, and a metal layer having a thickness equivalent to 1/3 or less of the thickness of the heat insulating layer and 0.001mm thick or more, formed on the surface of the heat insulating layer. (2) The metal layer adheres to the heat insulating layer through a fine-uneven interface and (3) the heat insulating layer consists of at least, two layers such as a first heat insulating layer having a thickness equivalent to 1/3 of the total thickness of the heat insulating layer and 0.01mm thick or more, being into contact with the metal layer and a second heat insulating layer having a thickness equivalent to 1/2 or more of the total thickness of the metal layer. (4) The first heat insulating layer comprises a straight-chain high molecular weight polymer which shows outstanding heat resistance and high tenacity and the second heat insulating layer comprises a straight-obtain polymer with low softening temperature and/or fracture elongation compared to the first heat insulating layer.
申请公布号 JPH10138252(A) 申请公布日期 1998.05.26
申请号 JP19960293917 申请日期 1996.11.06
申请人 ASAHI CHEM IND CO LTD 发明人 KATAOKA HIROSHI;UMEI ISAO
分类号 B29C33/38;B29C45/26;B29C49/48;B29L22/00;(IPC1-7):B29C33/38 主分类号 B29C33/38
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