| 摘要 |
Methods for testing interconnections on an electronic assembly include the steps of dynamically generating an interconnect topology model from one system, generating test patterns to test the interconnections, applying the test patterns to the boundary scan cells of the system under test to test the interconnections, and determining whether the interconnections match the interconnect topology model. The invention thus dynamically generates an interconnect topology model from a known working system, rather than deriving the interconnect topology model from design data that describes all the interconnections on an electronic assembly.
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