| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain the subject composition comprising a UV light-curable resin having a specific composition and an epoxy compound having plural epoxy groups in the molecule and capable of exhibiting excellent effects on resolution, sensitivity, soldering heat resistance, etc. SOLUTION: This ultraviolet light-curable resin composition comprises (A) a ultraviolet light-curable resin produced by reacting (i) the copolymer of a polymerizable monomer component containing an epoxy group-containing ethylenic unsaturated monomer and maleimide (derivative) with (ii) a carboxyl group-containing ethylenic unsaturated monomer and (iii) a saturated polybasic acid anhydride and (B) an epoxy compound having two or more epoxy groups in the molecule. The composition can be compounded with a photopolymerization initiator and a diluent to prepare a photosolder resist ink capable of forming solder resists exhibiting excellent soldering heat resistance, gold-plating resistance, etc., on substrates, and capable of being developed with diluted alkali aqueous solutions.</p> |
