MOLD FOR EVALUATING FLOW OF BONDING WIRE AND RESIN FLUIDITY AND EVALUATION USING THIS MOLD

摘要

PROBLEM TO BE SOLVED: To provide a method by which it is possible to evaluate the flow of a bonding wire and the fluidity of a molding resin simultaneously in a resin molding process and also perform low cost and simple evaluation without using an expensive IC chip as well as a mold for evaluation. SOLUTION: The mold 1 for evaluating the flow of a bonding wire and resin fluidity consists of a spiral part 2 which is a spiral flow path for a molding resin, a plate inserting part 3 into which a plate corresponding to an island part on a lead frame is introduced and a resin injection aperture 4. A plate to which a bonding wire is bonded orthogonally with a direction in which the resin is injected, is introduced into the plate introducing part 3. Further, the resin is injected into the mold 1 from the resin injection aperture 4 to perform the molding of the resin and then the amount of a wire deformation and the spiral length of the resin flowing into the spiral part 2 are measured.