发明名称
摘要 <p>A sliding-contact material comprising a backing steel plate optionally plated with Cu, and a layer of sintered copper alloy formed on one of the surfaces of the backing steel plate, wherein the layer of sintered copper alloy consists essentially of 4 to 20 wt % Sn, 1 to 10 wt % Ni, 0.05 to 1 wt % B, and balance of Cu and incidented impurities, and does not practically include P, and the sintered copper alloy has a Vickers hardness not less than Hv 100.</p>
申请公布号 JP2756407(B2) 申请公布日期 1998.05.25
申请号 JP19930336533 申请日期 1993.12.28
申请人 DAIDO METARU KOGYO KK 发明人 TANAKA TADASHI;SAKAMOTO MASAAKI;YAMAMOTO KOICHI;HIGUCHI GETSUKO;OZAKI KOJU
分类号 B22F5/00;B22F7/04;B32B15/01;C22C1/04;C22C9/02;F16C33/12;(IPC1-7):B22F7/04 主分类号 B22F5/00
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