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发明名称
반도체 패키지 소켓(Socket)
摘要
<p>본 고안은 반도체패키지가 삽탈되는 케이스(Case)와, 반도체패키지의 리드에 접속되고 케이스 외부로 노출된 입출력단자인 핀군(群)을 갖는 반도체패키지 소켓으로써, 삽입된 반도체패키지의 리드와 접속되는 접속부위의 높이가 다른 다수개의 핀군을 구비하여 적어도 2개 이상의 반도체패키지를 적충하여 삽입 가능한 것이 특징이다.</p>
申请公布号
KR19980011611(U)
申请公布日期
1998.05.25
申请号
KR19960025128U
申请日期
1996.08.21
申请人
发明人
分类号
主分类号
代理机构
代理人
主权项
地址
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