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发明名称
외곽요철형 BGA(BALL GRID ARRAY) 패키지
摘要
<p>외곽둘레가 요철형상을 이루는 기판(10)과, 기판(10)상면의 정사각형의 모울드(20)와, 기판하면의 정사각형의 격자구조의 솔더볼(30)으로 이루어져, 리플로어 솔더링시 외곽둘레가 요철형상을 이루는 기판(10)에 의해 중심부로의 열전달이 용이한 외곽요철형 BGA(BALL GRID ARRAY) 패키지</p>
申请公布号
KR19980012462(U)
申请公布日期
1998.05.25
申请号
KR19960026025U
申请日期
1996.08.27
申请人
发明人
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主分类号
代理机构
代理人
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