SEMICONDUCTOR DEVICE AND PRODUCTION THEREOF

摘要

PROBLEM TO BE SOLVED: To enhance adhesion between a mold resin and a wiring board without prolonging the cure time at the time of molding a semiconductor device. SOLUTION: The semiconductor device 1 comprises a semiconductor chip 3 in which an integrated circuit is formed, a wiring board 4 comprising an insulating base material and a wiring metallization formed thereon and mounting the semiconductor chip 3 on one side thereof, a mold resin 7 for sealing the semiconductor chip 3 while being bonded to the sealing region of the wiring board 4, and a plurality of bumps projecting from the other side of the wiring board 4 and connected electrically with the semiconductor chip 3 through the wiring metallization wherein a recess 9 is made in a sealing region corresponding to the vicinity of the gate 16 of a molding die 11.