| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for mounting a surface mounting semiconductor device at low mounting height. SOLUTION: In the method for mounting a surface mounting semiconductor device comprising a resin part 3 for sealing a semiconductor element mounting part, outer leads 4 led out from the side faces of the resin part 3, and jointing parts 5 at the forward end of the outer leads 4 formed substantially in parallel with a printed board 1 to be mounted, a recess 7 is made in the printed board 1 in order to receive the resin part 3 and the jointing parts 5 are connected with a wiring metal 2 formed on the surface of the printed board 1. Especially, when the heat dissipation effect is enhanced, a conductor layer 8 is formed on the inner bottom face of the recess 7 in the printed board 1 and brought into contact with the resin part 3.</p> |
