| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a vacuum chuck table apparatus capable of chucking a thin substrate at a high accuracy, without edge deforming or swelling of the periphery of the substrate such as semiconductor wafer. SOLUTION: A vacuum chuck table apparatus 1A comprises a porous vacuum sucking part 21 buried in a central portion of a stage 22, having an annular groove 24 at a periphery 23. While feeding pure water through a feed pipe 25 from a feed tank 31 into the annular groove 24, a semiconductor wafer S mounted on the stage 22 is sucked, chucked and held by the sucking part 21. The periphery of the wafer S is sealed with pure water overflowing from the annular groove 24 to prevent a working liq. E from flowing between the wafer S and sucking part 21, thereby vacuum chucking the wafer S at a high accuracy.</p> |
