SEMICONDUCTOR CHIP MODULE AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To fabricate a semiconductor chip module having fine dimensional relations, without using a valuable working machine and without executing fine controls. SOLUTION: The module 1 comprises a pair of semiconductor chips 2, 3 having active surfaces on which electrodes 4, 5 are formed at corresponding positions and mutually connected. The active surfaces of the chips 2, 3 cover the active surface of at least one chip 2 and are bonded through a protective film 6 having openings to expose electrodes 4. The electrodes 4, 5 of the chips 2, 3 are formed at heights not greater than the thickness of the film 6 and mutually connected through bump electrodes 7 deformed by melting.