| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated ceramic electronic component, wherein satisfactory characteristics can be obtained stably for points such as insulation resistance characteristic and humidity-proof load characteristic. SOLUTION: Si-glass paste is applied to edge faces 6, 7 of a ceramic laminated body 5 for improving the sealing property of the ceramic laminated body 5 to plating solution, and it is thermally diffused into the laminated body 5. Thereby, a region from the edge faces 6, 7 from 10 to 50μm toward an inside is made to be glass-rich regions 14, 15 whose abundance ratio of Si is at least 60% or higher. Furthermore, 3μm or thicker glass layers 16, 17 are formed between the edge faces 6, 7 and outside electrodes 8, 9.
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