| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus, which can evenly coat a processing substrate with a chemical liquid supplied from a liquid supply nozzle while saving the solution. SOLUTION: A semiconductor manufacturing apparatus 20 includes a liquid supply nozzle 23 which in turn has a nozzle frame base 24, a porous nozzle material 25 and a filling chamber 30. The porous nozzle material 25 is made of ceramic and is formed to have the same size and shape as those of a processing substrate 21. A valve 27 is opened to supply a chemical liquid 31 from a chemical supply pipe 26 to the filling chamber 30. After the valve 27 is closed, a valve 29 is opened to introduce pressurized air from a pressurized air/pure water supply pipe 28 into the filling chamber 30. This causes the chemical liquid 31 in the chamber 30 to exude from the surface of the nozzle material 25 and adhere thereto. Under this condition, when a spacingαbetween the substrate 21 and the porous nozzle material 25 is made narrow, the chemical liquid 31 on the material 25 is also brought into contact with the entire surface of the substrate 21 at the same time. Thereafter, when the pressurized air is introduced as the spacingαis made wide, this causes the chemical liquid 31 within the chamber 30 to pass through the porous material 25 and to move onto the surface of the substrate 21. |
