CIRCUIT BOARD AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent a dielectric film on a circuit board from locally thermally expanding owing to heating of a resistor and resistance film formed on the dielectric film from being broken. SOLUTION: Microstrip lines are made from a benzocyclobutene(BCB) dielectric film 3 on which a radiating conductor film 4 is formed. A resistance film 6 is formed thereon through a layer insulation film 4 composed of a silicon oxide film or silicon nitride film and connected to a wiring conductor film 7. Heat from the resistance film 6 is quickly dispersed from the entire radiating conductor film 4 to a wide area to thereby suppress the BCB film 3 from local thermal expansion, resulting in reduction of the tensile stress or bending stress exerted on the resistance film 6, thus preventing this film 6 from being broken.