SUPERCONDUCTING CIRCUIT STRUCTURE AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To reduce the characteristic impedance of the upper electrode wiring layer, with which a microstrip line structure is constituted together with a lower electrode wiring layer whose characteristics impedance is susceptible to become higher by a method in which the microscopic strip structure is formed by conducting a Josephson junction to the lower electrode and the upper electrode and an interlayer insulating layer is pinched between ground planes. SOLUTION: A heaved-up part 25, which is heaved up toward the upper electrode wiring layer 57, is provided on a ground plane 21. As a result, there is no large dimensional difference between the thickness h1 of the first interlayer insulating layer 31 located between the lower electrode wiring layer 54 and the thickness h2 of the second interlayer insulating layer 32 located between the upper electrode wiring layer 57 and the ground plane upheaved part 25. The upheaved part 25 is composed of the first and the second raised layers 23 and 24 laminated on the ground plane 21.