| 摘要 |
<p>1,253,225. Electroless Ni plating. STAUFFER CHEMICAL CO. Nov.21, 1968 [Dec.4, 1967], No.55226/68. Heading C7F. An acidic electroless Ni plating solution comprises Ni ions, hypophosphite ions, borate ions, fluoride ions, and ions of an organic hydroxycarboxylic acid other than glycolic acid and has a pH of at least 5.0. The ions are preferably provided by, respectively, Ni fluoborate or sulphamate, Na, K, Mg or NH 4 hypophosphite, boric acid, Na, K, or NH 4 fluoride; acids mentioned are hydroxypropionic and hydroxybutyric. The solution may contain (in g/l) Ni<SP>++</SP>, 1-40; H 2 PO 2 , 50-150, borate ion 10-50; F<SP>-</SP> 1-10; and may further contain acetate ions, thiourea, and a wetting agent. Glass may be etched as by HF, sensitized with SnCl2 and PdC 2 and then plated with Ni using the above solution; in the case of plating glass, the solution may contain 5-80 g/l of glycolic acid.</p> |
