| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component which is small size, having cost performance and reliability and by providing a member blocking intrusion of resin inside a through hole so as to cover the upper surface of the through hole with resin. SOLUTION: A dry film 9 is adhered partially on the upper surface of a substrate 1 or an upper surface electrode 2 so as to cover at least a through hole 6. Then, sealing resin 7 is molded on the substrate 1 with a pasted dry film 9. Sealing resin 7 covers also the right top of the through hole 6 and is, being prevented from intruding into the through hole since the dry film 9 blocks it. Accordingly, one of the outer dimensions of the electronic parts to be almost defined by the distance between through holes can be kept fairly small. |
