| 摘要 |
<p>PROBLEM TO BE SOLVED: To easily and suitably enable the mounting work of an electronic component onto a carrier tape by automation, by mounting the electronic component on a spreading region of solder paste with a mounting equipment, and solderling the electronic component to a terminal portion by heating the solder paste. SOLUTION: A feeding equipment 4 of a carrier tape, a solder paste spreading equipment 5, a mounting equipment 6 of an electronic component, a heating equipment 7 and a reeling-up equipment 8 of the carrier tape are installed. In the mounting equipment 6, loading work of an electronic component of a chip type on a carrier tape 1 is performed when solder paste spreading work is performed with the solder paste spreading equipment 5. A spreading region and its peripheral region of solder paste of the carrier tape 1 are positioned and fixed in a suitably tense state. The carrier tape 1 on which the electronic component is mounted is transferred to the heating equipment 7, and the solder paste is suitably heated and fused. Thereby manufacturing efficiency is remarkably improved.</p> |
