发明名称 BUMP-FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a bump-forming method, capable of stably cutting wires. SOLUTION: A wire 12, passing through a hole 11a of a capillary 11, is heated at the top end to form a ball 12a which is then pressed and bonded to a terminal electrode 14. Thereafter, only the capillary 11 is moved up and a current/voltage is applied to a discharge electrode 15 to cause an electric discharge at the top end of a hole 11a. This causes the wire 12 to be cracked and the wire 12 to be cut off at the hole end of the capillary 11.
申请公布号 JPH10135220(A) 申请公布日期 1998.05.22
申请号 JP19960287156 申请日期 1996.10.29
申请人 TAIYO YUDEN CO LTD 发明人 SUZUKI YOSHIKI;MURAIDA MICHIO;NAKADA YOSHISHIGE;SUZUKI KAZUTAKA
分类号 H01L21/60;H01L21/321 主分类号 H01L21/60
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