| 摘要 |
PROBLEM TO BE SOLVED: To increase the yield of wafer to increase the manufacturing quantity by measuring a polished pad part in a plurality of positions, and controlling the flatness of the pad part so as to be kept in a prescribed specification. SOLUTION: A device 10 has a frame 24 and a measuring device 26. A carrying mechanism 28 and the measuring device 26 are moved across a polished pad 12 to measure the distance from the pad surface 27 to a reference plane p1 in a plurality of positions by a laser sensor 74, and the flatness of the pad 12 is displayed. The frame 24 has a ceramic base 30 provided directly on the polished pad 12, and the base 30 is used as the reference plane of the measuring device 26. For first and second laser sensors 74, 78, whether the sensor 74 is slipped from the reference plane P1 or not is detected by the sensor 78 to correct the deviation of the carrying mechanism 28. A controller receives the inputs from a converter 82 and the laser sensors 74, 78, and combines and outputs them so as to show the flatness of the upper surface 27 of the polished pad 12, and the flatness is recorded in a recording device. When the measured value exceeds a prescribed limit, the pad 12 is formed so as to provide an allowable flatness. |
