| 摘要 |
<p>PROBLEM TO BE SOLVED: To make a semiconductor element on which an IC chip is mounted possible to cope with miniaturization, low cost and high heat dissipation, by forming wiring circuits on a glass board and mounting the IC chip on the wiring circuits. SOLUTION: An IC chip 1 is connected with wiring circuits 3 on a glass board 4. Both bumps 2 are thermally fusion-welded. A configuration wherein the IC chip 1 is mounted on a printed board is used usually as a semiconductor element. A printed board wherein a copper foil is used as a base and a part of the copper foil is plated with gold, or a ceramics constituted of a thick film composed of metal and glass is used as the wiring circuit 3. Glass is used as the board 4, and the wiring circuit 3 is formed of compound oxide composed of indium and tin. By using the glass board, the weight can be reduced, thermal conductivity and radiation rate are excellent, and cost reduction is enabled. The board size can be remarkably reduced by using a thin wiring circuit.</p> |
