EXPOSURE MASK, ALIGNER, EXPOSURE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING ALIGNER, AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBY

摘要

PROBLEM TO BE SOLVED: To accurately adjust a gap between a wafer and a mask, even when the wafer has an irregular surface thickness. SOLUTION: A mask 1 has a membrane 4 formed thereon. Provided on the membrane 4 is a pattern to be transferred. The mask 1 is disposed so opposed to a wafer 8 held in a frame 6. A sensor 7 is provided in a region of the frame 6 holding the mask 1 for measuring a distance from the wafer 8. The distance sensor 7 measures the distance from the wafer 8 by projecting a laser beam 7a to the wafer 8 and using light reflected or scattered by the wafer. A mask frame 2 of the mask 1 is provided with a measuring hole 5 at a position, corresponding to the position of the sensor 7, so that the laser beam 7a from the sensor 7 is passed through the hole 5 and illuminated on the wafer 8, whereby the sensor measures the gap between the mask 1 and the wafer 8.