Production of electrically conducting bond

摘要

Production of an electrically conducting band comprises arranging an electrically insulating layer (1,6) between the layers of a conducting plate. The insulating layers are removed between the layers to be connected in the region of the electrically conducting bond to be formed or they are applied only selectively in the region outside of the electrical connection to be formed. A lift-off lacquer (3) with corner surfaces is selectively applied to the region of the electrical connection not to be formed on the uppermost insulation layers (1,6). The multilayer conducting plate is sputtered with metal particles (4) and the lift-off lacquer removed to produce a metallic conducting mask as the basis of the electrical connection. Finally the base is reinforced by applying further metal particles (5) to form the final conducting path thickness.