| 摘要 |
<p>PCT No. PCT/CH94/00076 Sec. 371 Date Sep. 15, 1995 Sec. 102(e) Date Sep. 15, 1995 PCT Filed Apr. 18, 1994 PCT Pub. No. WO94/29901 PCT Pub. Date Dec. 22, 1994The inventive device basically consists of a T-shaped cooling element (2), divided into a rib (14) and a crossplate (16), with said device secured to the circuit board (1) by means of screws (9). The base plate (6) of a spring element (15) is inserted between the rib (14) of the cooling element (2) and the circuit board (1). This base plate (6) is equipped with at least one spring tab (7) on each side. The rib (14) is equipped with threaded openings (11) that are flush with the openings in the base plate (6). The base plate (6) is equipped with an angled tab (12) at each end that is adjusted to the corresponding opening in the circuit board (1) for precise positioning of the base plate (6). The semiconductors (3, 4) that are to be attached and that are soldered to electrical connectors (5) are pressed against the surface of the crossplate (16) facing the circuit board by means of the spring tabs (7). Depending on the potential position of the semiconductor (3, 4) or the design of its housing, an insulation platelet (8) is inserted in between the semiconductor (3, 4) and the crossplate (16).</p> |
