| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be made thin in its structure. SOLUTION: A semiconductor wafer is formed with recognition marks 23 in the form of broken lines along dicing lines. Each of the diced semiconductor chips 21 is provided with electrode pads 221, 222,... along its end edges, the recognition marks 23 formed in the chip 21 are formed as broken at positions corresponding to the electrode pads 221, 222,..., and electrical cut-off parts are formed between the electrode pads 221, 222,.... Accordingly, even when a curling-up takes place by cutting off the wafer at the recognition marks 23 and brought into contact with lead wires connected to the pads 221, 222,..., undesirable electrical pass between the pads can be prevented. |
