| 摘要 |
PROBLEM TO BE SOLVED: To provide an overlay accuracy measuring pattern and method of measuring overlay accuracy whereby it can be accurately measured with enlarged edge regions but the same size as before. SOLUTION: The overlay accuracy measuring pattern 10 is composed of an outer and inner process patterns 11, 12 and resist pattern 13, each formed like a square frame having a zonal upper surface by the lithography. The process patterns 11, 12 are formed on a substrate and resist pattern 13 is formed between these patterns 11, 12 on an upper layer film of the substrate. The outer pattern 11 has approximately the same size as that of the prior art one, the patterns 11, 12, 13 are spaced by at least 2μm. The overlay accuracy is obtained by measuring the deviations of the resist pattern from the process patterns to compute the average of the deviations. |
