| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor type heat dissipation structure having a simple constitution and high heat dissipation effect. SOLUTION: A semiconductor element 1 is bonded in flip chip for mounting and electrically connected to a substrate 4 through bumps 2, which are formed at chip side pads 3a for the semiconductor element 1 and bonded to substrate side pads 3b. The gap between the chip 1 and the substrate 4 is sealed with a resin. A high-thermal conductivity resin 6 is applied to the element 1 by the printing or coating using a dispenser. The heat generated from the element 1 is transmitted to the resin 6 and escapes. For a large amt. of heat generated in the element 1, the resin 6 is much applied to enhance the heat dissipation effect.
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