| 摘要 |
PROBLEM TO BE SOLVED: To surely connect flat parts formed by pressing balls over the entire surface by vibrating a bonding stage in a direction of the wire toward and away from a work. SOLUTION: The wire bonding apparatus comprises an oscillator 13, vibrating means 31 operative synchronously with the oscillator 13 being actuated such that when the ball 14a of a wire 14 is pressed flat by a capillary 9, the oscillator 13 is actuated for specified time to apply an ultrasonic vibration as shown by the arrow U while a motor of the vibrating means 31 is actuated for the same time at an amplitude set to a level not damaging an IC chip 20 as well as pads 20. This accelerates alloying the peripheral portion and central portion of the flat part, thereby ensuring a reliable connection over the entire surface. |
