| 摘要 |
PROBLEM TO BE SOLVED: To reduce the inductance of a module by mounting even number of semiconductor elements on an insulation substrate, providing a circuit unit for parallel operation of even number of insulation substrates, and disposing module outer terminals corresponding to the circuit unit to thereby operate in parallel from outside the module. SOLUTION: Even no. of semiconductor elements 101, 102 are mounted on each of DBC-AlN substrates 103. An IGBT unit to be operated in parallel through terminal wirings in the module is composed of even number of DBC-AlN substrates 103. The IGBT units are wired in the module and operated in parallel. This structure ensures that even a large-capacity module with many semiconductor elements is operative with keeping these elements balanced enough to be switched at high speed and enhances the short-circuit resistance. This also reduces the inductance of the module and makes uniform the solder reliability for connecting the terminals to the insulation substrates even in a large-capacity and large-size module. |
