| 摘要 |
PROBLEM TO BE SOLVED: To provide a plated circuit for electric circuit board, which prevents a photo resist part from peeling out of the metal foil even in filling a conductor circuit pattern groove with conductor, and does not cause trouble in removing the metal foil from the photo resist part and the conductor circuit pattern part after filling the conductor circuit pattern groove with conductor, and to provide its manufacturing method. SOLUTION: A plated circuit 4 for electric circuit board is provided by forming a photo resist layer on the surface of a metal foil 1, by forming a conductor circuit pattern groove on the photo resist layer by etching, and by filling the conductor circuit pattern groove with conductor so as to form a conductor circuit pattern 3. The surface roughness (Rz) of the metal foil 1 which contacts with the conductor circuit pattern 3 and the photo resist part 2 is set within a range of 3-11μm.
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