发明名称 |
Method of reducing hot-electron degradation in semi-conductor devices |
摘要 |
A method of reducing the degradation effects associated with avalanche injection or tunnelling of hot-electrons in a field-effect semiconductor device is disclosed and includes covering the active regions of the semiconductor device with a protective titanium based barrier layer (19) which is deposited directly underneath the ordinary metalization layers (20) used for connecting the devices to bit and word lines within an array. Inclusion of the titanium based barrier layer in a flash memory device results in a substantial improvement in the erasetime push-out and reduces excess charge loss normally associated with hot-electron devices. The titanium based layer can be of titanium, titanium nitride, and titanium tungsten. <IMAGE> |
申请公布号 |
HK1000976(A1) |
申请公布日期 |
1998.05.15 |
申请号 |
HK19970102597 |
申请日期 |
1997.12.23 |
申请人 |
INTEL CORPORATION |
发明人 |
LAI STEFAN K;TANG DANIEL N;WANG SIMON Y;KAO SUSAN L;TRIPLETT BAYLOR B |
分类号 |
H01L21/8247;H01L23/532;H01L29/45;H01L29/78;H01L29/788;H01L29/792;(IPC1-7):H01L |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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