| 摘要 |
PROBLEM TO BE SOLVED: To improve long-term reliability between a semiconductor chip and a base board in semiconductor chip resin-sealing for a multichip module. SOLUTION: A semiconductor chip 1 is provided with bumps 2 on the electrodes to be connected with a base board 6, and is connected with the base board 6 with solder 3. On the base board 6, a chip pad 5 for connecting with the bumps 2 of the semiconductor chip 1 and a pattern and a resist 8 which constitute an electric circuit are provided. A through hole 12, which electrically connects layers on the base board, and a land 7, which connects with the through hole 12, are not arranged on the part along the edge of the semiconductor chip 1 on the base board 6. A process of applying sealing resin 4 between the semiconductor chip 1 and the base board 6 after mounting the semiconductor chip 1 on the base board 6 is smoothly performed, since there is not land 7 at the periphery of the semiconductor chip 1. |
