METHOD OF CUTTING SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a method of cutting a semiconductor wafer, so as to pelletize a semiconductor wafer simply and securely without the possibility of quality degradation. SOLUTION: A heater block 4 is brought into close contact with the lower surface of a stage 2 for heating the stage 2, transfer heat to a semiconductor wafer 1, and heat it indirectly. When the semiconductor wafer 1 is heated up to a specified temperature, a cooled thermo-module 5 is brought into close contact with the upper surface of the semiconductor wafer 1 under a uniform load, and the semiconductor wafer 1 is rapidly cooled to apply a thermal stress to it. Thereby cracks are generated on dicing lines to pelletize the semiconductor wafer 1.