METHOD AND APPARATUS FOR COINING SOLDER BALLS ON AN ELECTRICAL CIRCUIT PACKAGE
摘要
A method and apparatus are provided for coining solder balls on an electrical circuit package. Generally, this method includes placing a slug on one or more of the solder balls; and applying sufficient pressure for a sufficient period of time on the slug to flatten the surface of the solder balls so as to form planar solder coins. The apparatus includes a press; a ram attached to the press; a platform for receiving the package and a slug placed upon the solder balls.
申请公布号
WO9820532(A1)
申请公布日期
1998.05.14
申请号
WO1997US18991
申请日期
1997.10.22
申请人
W.L. GORE & ASSOCIATES, INC.
发明人
PETEFISH, WILLIAM, GEORGE;PIPER, BOYDD;WALKER, THOMAS, E.