| 摘要 |
<p>The present invention relates to a novel arrangement for attaching, by screw threads, one device to another wherein the one device has a greater thermal rate of expansion than the other and the devices are assembled at a temperature which is lower than that at which the two devices are regularly subjected. In particular, the novel arrangement maintains the security of the attachment where the differing thermal rates of expansion would normally cause the screw thread attachment to become loose.</p> |
