A semiconductor workpiece cleaning apparatus has (a) a chamber (1) in which the workpiece (2) is sprayed with and/or immersed in a cleaning chemical liquid and/or pure water (5); (b) a supply system for supplying drying chemical liquid or vapour in contact with the cleaning chemical liquid and/or pure water in which the workpiece is immersed; and (c) a discharge system for discharging the cleaning chemical liquid and/or pure water confined by the drying chemical liquid or steam. When the workpiece (2) is cleaned by spraying with cleaning chemical liquid and/or pure water, another cleaning chemical liquid is preferably supplied to the chamber (1) to immerse the workpiece. Also claimed is a semiconductor workpiece cleaning process employing the above apparatus.
