摘要 |
A smart sensor module includes a microcontroller and a signal conditioning integrated circuit. In a preferred embodiment, the signal conditioning integrated circuit is a mixed signal application specific integrated circuit (ASIC) incorporating an instrumentation amplifier, offset correction, sensitivity correction, low pass filtering, an analog-to-digital converter (ADC), a temperature sensor, digital I/O interface, a crystal oscillator circuit, and power on reset open collector output. The ADC can be multiplexed to the transducer, the temperature sensor or an external input. All features of the ASIC can be dynamically reconfigured at any time by the microcontroller. Offset correction is implemented with a 4-bit coarse adjustment digital-to-analog converter (DAC) and a 7-bit fine adjustment DAC to control the instrumentation amplifier reference voltage. The coarse adjustment allows compensation of sensor-to-sensor offset variations, while the fine adjustments allows dynamic or real-time compensation of temperature-induced variations. The sensitivity correction is accomplished with a programmable system gain configured as a coarse gain adjustment and a fine gain adjustment. The coarse gain adjustment allows compensation of sensor-to-sensor sensitivity variations. The fine gain adjustment allows dynamic or real-time compensation of temperature-induced sensitivity variations. The smart sensor module allows very precise calibration of the sensor, signal processing capabilities, decision making capability and serial interface capability. |
申请人 |
ELECTRONICS DEVELOPMENT CORPORATION;RITMILLER, GEORGE, R., III |
发明人 |
RITMILLER, GEORGE, R., III |