| 摘要 |
<p>The invention relates to an ejector pin (8) receivable in a mould part of a mould for encapsulating electronic components mounted on a carrier, wherein the substantially cylindrical ejector pin (8) is provided with a side wall in which at least one recess (11) is arranged close to the end which makes contact with the product for ejecting. The invention also relates to a mould part (16) in which an opening is arranged for guiding an ejector pin, wherein at least one recess (19) is arranged in the wall of the opening. The invention also comprises a mould for encapsulating electronic components in addition to a method for sealing an interspace between an ejector pin and an opening in a mould part.</p> |
