METHOD FOR FORMING A THROUGH-VIA IN A LAMINATED SUBSTRATE

摘要

A method of forming a through-via (62) in a laminated substrate (60) by applying a polymeric photoabsorptive layer (68) on an exposed bottom surface of a laminated substrate. A through-via is laser drilled in the substrate through the substrate to a bottom of the substrate. The photoabsorptive layer (68) formed on the bottom surface of the substrate is then removed.