| 摘要 |
<p>A method of controlling warp of electronic assemblies includes mounting a first component (124) to one side of a substrate (126), the first component having a different coefficient of thermal expansion (CTE) than the substrate and thereby tending to generate bending moments that distort the shape of the first component, and mounting a second component (132) to an opposite side of the substrate and opposite the first component. The second component has a CTE that approximately matches that of the first component, thereby tending to generate bending moments that offset the distorting bending moments.</p> |
