发明名称 METHOD OF INCREASING PACKAGE RELIABILITY BY DESIGNING IN PLANE CTE GRADIENTS
摘要 <p>A method of manufacturing a multi-layered structure includes forming first and second layers, patterning the first layer, determining a distribution of material in at least one area of the first layer, and altering the material content of one of the first and second layers in at least one of the first layer area and a corresponding area of the second layer to approximately match the material content of the first layer and second layers.</p>
申请公布号 WO1998020556(A1) 申请公布日期 1998.05.14
申请号 US1997018639 申请日期 1997.10.17
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