Microelectronic component esp. semiconductor memory component

摘要

The component comprises a semiconductor chip (1) which is arranged on a lead frame (6). The chip (1) and the frame (6) are surrounded by a housing made of a moulding. An insert is arranged on the lead frame (6) at least on the side next to the semiconductor chip. Preferably the insert holds the chip in the lead frame and is the same height as the chip. The insert may be made of the same material as the housing or the frame. In another embodiment, instead of having an insert, the chip is rotated such that a side edge of it forms a predetermined angle with a reference edge of the lead frame.