发明名称 |
Verfahren zur Herstellung eines integrierten Hybridbausteins |
摘要 |
An integral heat sink-terminal structure for a hybrid circuit assembly includes a heat dissipating plate for bonding to a substrate of the hybrid integrated circuit and terminals for connection to the substrate. The heat dissipating plate and the terminals are unitary with a common frame in the same predetermined positional relationship relative to the substrate before and after they are connected to the substrate. When this structure is used in fabricating a hybrid integrated circuit assembly, the heat dissipating plate is first bonded to the substrate and then the terminals are connected to the substrate. |
申请公布号 |
DE4231869(C2) |
申请公布日期 |
1998.05.14 |
申请号 |
DE19924231869 |
申请日期 |
1992.09.23 |
申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP |
发明人 |
MATSUMOTO, HIDEO, ITAMI, JP |
分类号 |
H01L23/36;H01L23/495;H01L23/498;H01L23/50;H01L25/16;H05K1/03;H05K3/00;H05K3/34;(IPC1-7):H01L23/367;H05K7/20;H01L23/48 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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