发明名称 |
LOW-VOLTAGE PUNCH-THROUGH TRANSIENT SUPPRESSOR EMPLOYING A DUAL-BASE STRUCTURE |
摘要 |
A punch-through diode transient suppression device has a base region of varying doping concentration to improve leakage and clamping characteristics. The punch-through diode includes a first region comprising an n+ region, a second region comprising a p- region abutting the first region, a third region comprising a p+ region abutting the second region, and a fourth region comprising an n+ region abutting the third region. The peak dopant concentration of the n+ layers should be about 1.5E18 cm-3, the peak dopant concentration of the p+ layer should be between about 1 to about 5 times the peak concentration of the n+ layer, and the dopant concentration of the p- layer should be between about 0.5E14 cm-3 and about 1.OE17 cm-3. The junction depth of the fourth (n+) region should be greater than about 0.3 mu m. The thickness of the third (p+) region should be between about 0.3 mu m and about 2.0 mu m, and the thickness of the second (p-) region should be between about 0.5 mu m and about 5.0 mu m. |
申请公布号 |
EP0840943(A1) |
申请公布日期 |
1998.05.13 |
申请号 |
EP19960917059 |
申请日期 |
1996.06.03 |
申请人 |
SEMTECH CORPORATION |
发明人 |
YU, BIN;HU, CHENMING;KING, YA-CHIN;POHLMAN, JEFFREY, T.;TRIVEDI, RITA |
分类号 |
H01L29/861;H01L29/866 |
主分类号 |
H01L29/861 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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