| 摘要 |
The apparatus for polishing semiconductor device is equipped with a polish pad which comprises an upper layer material and a lower layer material of differing degrees of hardness overlying one another, whereby semiconductor wafer is polished while being pressed against said polish pad, the degree of hardness of the upper layer material of said polish pad being set at Shore spring A hardness 92-98.5, and the degree of hardness of the lower layer material of said polish pad at Shore spring A hardness 78-87.5. |
