| 摘要 |
A method of making a surface-mount technology plastic-package ball-grid array integrated circuit assembly. According to the method, a surface-mount ball-grid array package is provided for an integrated circuit assembly. The array package has a circuit chip recess through which vias extend, opening on a bottom surface of the array package. A peripheral portion of the array package is defined around the vias formed in the recess. The array package is held on a vacuum chuck by applying vacuum to the peripheral portion of package. An adhesive material is then placed in the recess to extend partially through the vias. A circuit chip is finally disposed in the recess on the adhesive material to complete the fabrication process. Substantially ambient pressure is communicated to the vias on the bottom surface of the array package to prevent the adhesive from being pulled through the vias by the applied vacuum.
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