| 摘要 |
The invention relates to components such as pyroelectric sensors which are particularly sensitive to piezoelectric effects and which, consequently, are disturbed by the mechanical deformations or the vibrations which the component may experience. In order to limit these disturbances, it is proposed to insert, between the chip (10) carrying the pyroelectric layer and the bottom of the package (30), a flexible sheet (42) of silicone which absorbs the deformations of the package without transmitting them to the chip. Ultrasonic bonding of the connecting wires (34) is still possible despite the presence of the flexible sheet. The chip is preferably fixed to a metallized ceramic plate (40) and abutments (44) are preferably provided at the bottom of the package in order to limit the compression of the flexible sheet (42) during the bonding operation.
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