发明名称 |
System and apparatus for reducing arcing and localized heating during microwave processing |
摘要 |
A system and apparatus for reducing arcing and localized heating as a result of applying microwave energy to a microelectronic substrate having electronic components thereon is provided. A microwave furnace having a chamber is configured to secure a microelectronic substrate therewithin. The microelectronic substrate is electrically interconnected with a ground connected to an interior wall of the microwave furnace. A holder for securing a microelectronic substrate during the application of microwave energy and for providing the necessary electrical connections for grounding components and circuitry thereon is also provided. The holder may have a heat sink for protection against heat build-up and for maintaining a microelectronic substrate in a substantially flat orientation during microwave processing.
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申请公布号 |
US5750968(A) |
申请公布日期 |
1998.05.12 |
申请号 |
US19950497603 |
申请日期 |
1995.06.30 |
申请人 |
LAMBDA TECHNOLOGIES, INC. |
发明人 |
FATHI, ZAKARYAE;GERARD, RICHARD S.;WEI, JIANGHUA |
分类号 |
H05B6/80;H05K3/34;(IPC1-7):H05B6/80 |
主分类号 |
H05B6/80 |
代理机构 |
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代理人 |
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地址 |
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