| 发明名称 |
Semiconductor member, and process for preparing same and semiconductor device formed by use of same |
| 摘要 |
A semiconductor device having a substrate with an insulating surface and a non-porous semiconductor region bonded to the body of the device. A porous semiconductor region on the surface of the substrate was removed by etching.
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| 申请公布号 |
US5750000(A) |
申请公布日期 |
1998.05.12 |
| 申请号 |
US19960755356 |
申请日期 |
1996.11.25 |
| 申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
YONEHARA, TAKAO;SATO, NOBUHIKO;SAKAGUCHI, KIYOFUMI;KONDO, SHIGEKI |
| 分类号 |
H01L21/762;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/762 |
| 代理机构 |
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代理人 |
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