| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition capable of forming a coating film optimum for the surface protection of a silicon wafer and easily removable after polishing by dissolving or dispersing a polyvinyl alcohol in a solvent. SOLUTION: A polyvinyl alcohol(PVA) having a saponification degree of >=90mol%, preferably >=98mol% is dissolved or dispersed in a solvent (preferably, water methanol, propylene glycol, etc.). The molecular weight of the PVA is preferably 3×10<-3> to 0.3Pa.s in terms of viscosity measured by a Hoeppler viscometer as a 4wt.% aqueous solution at 20 deg.C. The amount of the solvent is preferably 90-97wt.%. The alkali resistance of the composition can be improved by adding a compound having double bond such as styrene and epoxy acrylate in an amount of 1-20wt.% based on PVA. The addition of a surfactant improves the peelability and that of a leveling agent such as silicone-based, fluorine-based or polymeric agent improves the film-forming property.
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